At a glance
- Work closely with the Chip-Package-Board CoDesign team to design, implement, test, and maintain innovative software solutions that support semiconductor design processes
- Explore and apply AI/ML algorithms to enhance automation and efficiency in Electronic Design Automation (EDA) workflows and improve Chip-Package-Board CoDesign methodologies
- Develop software solutions using Python, Java, and Cadence SKILL within the EDA framework to support advanced semiconductor design challenges
- Analyze data from design workflows to identify optimization opportunities and implement data-driven solutions using AI/ML approaches
- Create tools that integrate AI/ML-based optimizations for resource-intensive processes such as simulation, design validation, and testing
- Participate in code reviews, maintain high-quality documentation, and develop test plans to ensure robust software solutions
- Acquire skills in "Cadence SKILL" programming and apply it towards developing efficient solutions for CoDesign challenges
- Stay updated with the latest trends in software development, AI/ML, and EDA technologies, actively contributing with new ideas to improve processes
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